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Gravure printing of electronic structures on paper
Printed electronics is a set of
printing
methods used to create electrical devices on various substrates.
Printing typically uses common printing equipment suitable for defining
patterns on material, such as
screen printing,
flexography,
gravure,
offset lithography, and
inkjet.
By electronic industry standards, these are low cost processes.
Electrically functional electronic or optical inks are deposited on the
substrate, creating active or passive devices, such as
thin film transistors; capacitors; coils;
resistors. Printed electronics is expected to facilitate widespread, very low-cost, low-performance electronics for applications such as
flexible displays,
smart labels, decorative and animated posters, and active clothing that do not require high performance.
The term
printed electronics is often related to
organic electronics or
plastic electronics,
in which one or more inks are composed of carbon-based compounds. These
other terms refer to the ink material, which can be deposited by
solution-based, vacuum-based or other processes. Printed electronics,
in contrast, specifies the process, and, subject to the specific
requirements of the printing process selected, can utilize any
solution-based material. This includes
organic semiconductors,
inorganic semiconductors, metallic conductors,
nanoparticles, and
nanotubes.
For the preparation of printed electronics nearly all industrial
printing methods are employed. Similar to conventional printing,
printed electronics applies ink layers one atop another. So the coherent development of printing methods and ink materials are the field's essential tasks.
The most important benefit of printing is low-cost volume fabrication. The lower cost enables use in more applications. An example is
RFID-systems, which enable contactless identification in trade and transport. In some domains, such as
light-emitting diodes printing does not impact performance.
Printing on flexible substrates allows electronics to be placed on
curved surfaces, for example, printing solar cells on vehicle roofs.
More typically, conventional semiconductors justify their much higher
costs by providing much higher performance.
Printed and conventional electronics as complementary technologies.
Resolution, registration, thickness, holes, materials
The
maximum required resolution of structures in conventional printing is
determined by the human eye. Feature sizes smaller than approximately
20 µm cannot be distinguished by the human eye and consequently exceed
the capabilities of conventional printing processes.
In contrast, higher resolution and smaller structures are necessary in
much electronics printing, because they directly affect circuit density
and functionality (especially transistors). A similar requirement holds
for the precision with which layers are printed on top of each other
(layer to layer registration).
Control of thickness, holes, and material compatibility (wetting,
adhesion, solubility) are essential, but matter in conventional
printing only if the eye can detect them. Conversely, the visual
impression is irrelevant for printed electronics.
Printing technologies
The
attraction of printing technology for the fabrication of electronics
mainly results from the possibility of preparing stacks of
micro-structured layers (and thereby thin-film devices) in a much
simpler and cost-effective way compared to conventional electronics.
Also, the ability to implement new or improved functionalities (e.g.
mechanical flexibility) plays a role. The selection of the printing
method used is determined by requirements concerning printed layers, by
the properties of printed materials as well as economic and technical
considerations of the final printed products.
Printing technologies divide between sheet-based and
roll-to-roll-based approaches. Sheet-based
inkjet and screen printing are best for low-volume, high-precision work.
Gravure,
offset and
flexographic printing are more common for high-volume production, such as solar cells, reaching 10.000 square meters per hour (m²/h). While offset and flexographic printing are mainly used for inorganic and organic conductors (the latter also for dielectrics),
gravure
printing is especially suitable for quality-sensitive layers like
organic semiconductors and semiconductor/dielectric-interfaces in
transistors, due to high layer quality. If high resolution is needed, gravure is also suitable for inorganic and organic conductors. Organic
field-effect transistors and
integrated circuits can be prepared completely by means of mass-printing methods.
Inkjet printing
Inkjets are flexible and versatile, and can be set up with relatively low effort. However, inkjets offer lower throughput of around 100 m
2/h and lower resolution (ca. 50 µm). It is well suited for low-
viscosity,
soluble materials like organic semiconductors. With high-viscosity
materials, like organic dielectrics, and dispersed particles, like
inorganic metal inks, difficulties due to nozzle clogging occur. Because
ink is deposited via droplets, thickness and dispersion homogeneity is
reduced. Using many nozzles simultaneously and pre-structuring the
substrate allows improvements in productivity and resolution,
respectively. However, in the latter case non-printing methods must be
employed for the actual patterning step. Inkjet printing is preferable for organic semiconductors in
organic field-effect transistors (OFETs) and
organic light-emitting diodes (OLEDs), but also OFETs completely prepared by this method have been demonstrated. Frontplanes and
backplanes of OLED-displays, integrated circuits,
organic photovoltaic cells (OPVCs) and other devices can be prepared with inkjets.
Screen printing
Screen
printing is appropriate for fabricating electrics and electronics due
to its ability to produce patterned, thick layers from paste-like
materials. This method can produce conducting lines from inorganic
materials (e.g. for circuit boards and antennas), but also insulating
and passivating layers, whereby layer thickness is more important than
high resolution. Its 50 m²/h throughput and 100 µm resolution are
similar to inkjets. This versatile and comparatively simple method is used mainly for conductive and dielectric layers, but also organic semiconductors, e.g. for OPVCs, and even complete OFETs can be printed.
Aerosol jet printing
Aerosol Jet Printing (also known as Maskless Mesoscale Materials Deposition or M3D)
is another material deposition technology for printed electronics. The
Aerosol Jet process begins with atomization of an ink, via ultrasonic or
pneumatic means, producing droplets on the order of one to two
micrometres in diameter. The droplets then flow through a virtual
impactor which deflects the droplets having lower momentum away from the
stream. This step helps maintaining a tight droplet size distribution.
The droplets are entrained in a gas stream and delivered to the print
head. Here, an annular flow of clean gas is introduced around the
aerosol stream to focus the droplets into a tightly collimated beam of
material. The combined gas streams exit the print head through a
converging nozzle that compresses the aerosol stream to a diameter as
small as 10 µm. The jet of droplets exits the print head at high
velocity (~50 meters/second) and impinges upon the substrate.
Electrical interconnects, passive and active components
are formed by moving the print head, equipped with a mechanical
stop/start shutter, relative to the substrate. The resulting patterns
can have features ranging from 10 µm wide, with layer thicknesses from
tens of nanometers to >10 µm.
A wide nozzle print head enables efficient patterning of millimeter
size electronic features and surface coating applications. All printing
occurs without the use of vacuum or pressure chambers. The high exit
velocity of the jet enables a relatively large separation between the
print head and the substrate, typically 2–5 mm. The droplets remain
tightly focused over this distance, resulting in the ability to print
conformal patterns over three dimensional substrates.
Despite the high velocity, the printing process is gentle;
substrate damage does not occur and there is generally minimal splatter
or overspray from the droplets.
Once patterning is complete, the printed ink typically requires post
treatment to attain final electrical and mechanical properties.
Post-treatment is driven more by the specific ink and substrate
combination than by the printing process. A wide range of materials has
been successfully deposited with the Aerosol Jet process, including
diluted thick film pastes, nanoparticle inks, thermosetting polymers
such as UV-curable epoxies, and solvent-based polymers like polyurethane
and polyimide, and biologic materials.
Evaporation printing
Evaporation printing uses a combination of high precision screen printing with material vaporization to print features to 5
µm.
This method uses techniques such as thermal, e-beam, sputter and other
traditional production technologies to deposit materials through a high
precision shadow mask (or stencil) that is registered to the substrate
to better than 1 micrometer. By layering different mask designs and/or
adjusting materials, reliable, cost-effective circuits can be built
additively, without the use of photolithography.
Other methods
Other methods with similarities to printing, among them
microcontact printing and
nano-imprint lithography are of interest.
Here, µm- and nm-sized layers, respectively, are prepared by methods
similar to stamping with soft and hard forms, respectively. Often the
actual structures are prepared subtractively, e.g. by deposition of etch
masks or by lift-off processes. For example, electrodes for OFETs can
be prepared. Sporadically
pad printing is used in a similar manner.
Occasionally so-called transfer methods, where solid layers are
transferred from a carrier to the substrate, are considered printed
electronics.
Electrophotography is currently not used in printed electronics.
Materials
Both
organic and inorganic materials are used for printed electronics. Ink
materials must be available in liquid form, for solution, dispersion or
suspension. They must function as conductors, semiconductors, dielectrics, or insulators. Material costs must be fit for the application.
Electronic functionality and printability can interfere with each other, mandating careful optimization.
For example, a higher molecular weight in polymers enhances
conductivity, but diminishes solubility. For printing, viscosity,
surface tension and solid content must be tightly controlled.
Cross-layer interactions such as wetting, adhesion, and solubility as
well as post-deposition drying procedures affect the outcome. Additives
often used in conventional printing inks are unavailable, because they
often defeat electronic functionality.
Material properties largely determine the differences between
printed and conventional electronics. Printable materials provide
decisive advantages beside printability, such as mechanical flexibility
and functional adjustment by chemical modification (e.g. light color in
OLEDs).
Printed conductors offer lower conductivity and charge carrier mobility.
With a few exceptions, inorganic ink materials are dispersions of
metallic or semiconducting micro- and nano-particles. Semiconducting
nanoparticles used include silicon and oxide semiconductors. Silicon is also printed as an organic precursor which is then converted by pyrolisis and annealing into crystalline silicon.
PMOS but not
CMOS is possible in printed electronics.
Organic materials
Organic
printed electronics integrates knowledge and developments from
printing, electronics, chemistry, and materials science, especially from
organic and polymer chemistry. Organic materials in part differ from
conventional electronics in terms of structure, operation and
functionality, which influences device and circuit design and optimization as well as fabrication method.
In most organic materials, hole transport is favored over electron transport.
Recent studies indicate that this is a specific feature of organic
semiconductor/dielectric-interfaces, which play a major role in OFETs.
Therefore, p-type devices should dominate over n-type devices.
Durability (resistance to dispersion) and lifetime is less than
conventional materials.
Organic semiconductors include the conductive
polymers poly(3,4-ethylene dioxitiophene), doped with poly(
styrene sulfonate), (
PEDOT:PSS) and poly(
aniline) (PANI). Both polymers are commercially available in different formulations and have been printed using inkjet, screen and offset printing or screen, flexo and gravure printing, respectively.
Polymer semiconductors are processed using inkjet printing, such as
poly(thiopene)s like poly(3-hexylthiophene) (P3HT) and poly(9,9-dioctylfluorene co-bithiophen) (F8T2). The latter material has also been gravure printed. Different electroluminescent polymers are used with inkjet printing, as well as active materials for
photovoltaics (e.g. blends of P3HT with
fullerene derivatives), which in part also can be deposited using screen printing (e.g. blends of
poly(phenylene vinylene) with fullerene derivatives).
Printable organic and inorganic insulators and dielectrics exist, which can be processed with different printing methods.
Inorganic materials
Inorganic electronics provides highly ordered layers and interfaces that organic and polymer materials cannot provide.
A.C.
electroluminescent
(EL) multi-color displays can cover many tens of square meters, or be
incorporated in watch faces and instrument displays. They involve six to
eight printed inorganic layers, including a copper doped phosphor, on a
plastic film substrate.
A printed
gallium arsenide germanium solar cell
demonstrated 40.7% conversion efficiency, eight times that of the best
organic cells, approaching the best performance of crystalline silicon.
Substrates
Printed
electronics allows the use of flexible substrates, which lowers
production costs and allows fabrication of mechanically flexible
circuits. While inkjet and screen printing typically imprint rigid
substrates like glass and silicon, mass-printing methods nearly
exclusively use flexible foil and paper.
Poly(ethylene terephthalate)-foil (PET) is a common choice, due to its low cost and moderately high temperature stability.
Poly(ethylene naphthalate)- (PEN) and
poly(imide)-foil (PI) are higher performance, higher cost alternatives.
Paper's low costs and manifold applications make it an attractive substrate, however, its high roughness and high
wettability have traditionally made it problematic for electronics. This is an active research area,
however, and print-compatible metal deposition techniques have been
demonstrated that adapt to the rough 3D surface geometry of paper.
Other important substrate criteria are low roughness and suitable wet-ability, which can be tuned pre-treatment by use of
coating or
Corona discharge. In contrast to conventional printing, high absorbency is usually disadvantageous.
History
Albert
Hanson, a German by birth, is credited to have introduced the concept of
printed electronics. in 1903 he filled a patent for “Printed Wires,”
and thus printed electronics were born.
Hanson proposed forming a Printed Circuit Board pattern on copper foil
through cutting or stamping. The drawn elements were glued to the
dielectric, in this case, paraffined paper.
The first printed circuit was produced in 1936 by Paul Eisler, and that
process was used for large-scale production of radios by the USA during
World War II. Printed circuit technology was released for commercial
use in the USA in 1948 (Printed Circuits Handbook, 1995). In the over a
half-century since its inception, printed electronics has evolved from
the production of printed circuit boards (PCBs), through the everyday
use of membrane switches, to today’s RFID, photovoltaic and
electroluminescent technologies.
Today it is nearly impossible to look around a modern American
household and not see devices that either uses printed electronic
components or that are the direct result of printed electronic
technologies. Widespread production of printed electronics for household
use began in the 1960s when the Printed Circuit Board became the
foundation for all consumer electronics. Since then printed electronics
have become a cornerstone in many new commercial products.
The biggest trend in recent history when it comes to printed
electronics is the widespread use of them in solar cells. In 2011,
researchers from MIT created a flexible solar cell by inkjet printing on
normal paper.
In 2018, researchers at Rice University have developed organic solar
cells which can be painted or printed onto surfaces. These solar cells
have been shown to max out at fifteen percent efficiency.
Konarka Technologies, now a defunct company in the USA, was the
pioneering company in producing inkjet solar cells. Today there are more
than fifty companies across a diverse number of countries that are
producing printed solar cells.
While printed electronics have been around since the 1960s, they
are predicted to have a major boom in total revenue. As of 2011, the
total printed electronic revenue was reported to be at $12,385 (million). A report by IDTechEx predicts the PE market will reach $330 (billion) in 2027.
A big reason for this increase in revenue is because of the
incorporation of printed electronic into cellphones. Nokia was on of the
companies that pioneered the idea of creating a “Morph” phone using
printed electronics. Since then, Apple has implemented this technology
into their iPhone XS, XS Max, and XR devices.
Printed electronics can be used to make all of the following
components of a cellphone: 3D main antenna, GPS antenna, energy storage,
3D interconnections, multi-layer PCB, edge circuits, ITO jumpers,
hermetic seals, LED packaging, and tactile feedback.
With the revolutionary discoveries and advantages that printed
electronic gives to companies many large companies have made recent
investments into this technology. In 2007, Soligie Inc. and Thinfilm
Electronics entered into an agreement to combine IPs for soluble memory
materials and functional materials printing to develop printed memory in
commercial volumes.
LG announce significant investment, potentially $8.71 billion in OLEDs
on Plastic. Sharp (Foxconn) will invest $570m in pilot line for OLED
displays. BOE announce potential $6.8 billion in flexible AMOLED fab.
Heliatek has secured €80m in additional funding for OPV manufacturing in
Dresden. PragmatIC has raised ~ €20m from investors including Avery
Dennison. Thinfilm invests in new production site in Silicon Valley
(formerly owned by Qualcomm). Cambrios back in business after
acquisition by TPK.
Applications
Printed electronics are in use or under consideration for:
Norwegian company
ThinFilm demonstrated roll-to-roll printed organic memory in 2009.
Standards development and activities
Technical standards and roadmapping initiatives are intended to facilitate
value chain development (for sharing of product specifications,
characterization
standards, etc.) This strategy of standards development mirrors the
approach used by silicon-based electronics over the past 50 years.
Initiatives include:
- IPC/JPCA-4921, Requirements for Printed Electronics Base Materials
- IPC/JPCA-4591, Requirements for Printed Electronics Functional Conductive Materials
- IPC/JPCA-2291, Design Guideline for Printed Electronics
These standards, and others in development, are part of IPC’s Printed Electronics Initiative.