A bipolar junction transistor (bipolar transistor or BJT) is a type of transistor that uses both electrons and holes as charge carriers.
Unipolar transistors, such as field-effect transistors, use only one kind of charge carrier.
BJTs use two junctions between two semiconductor types, n-type and p-type.
BJTs are manufactured in two types: NPN and PNP, and are available as individual components, or fabricated in integrated circuits, often in large numbers.
Usage
BJTs can be used as amplifiers
or switches. This ability gives them many applications in electronic
equipment such as computers, televisions, mobile phones, audio
amplifiers, industrial control, and radio transmitters.
Current direction conventions
By
convention, the direction of current on diagrams is shown as the
direction that a positive charge would move. This is called conventional current.
However, current in many metal conductors is due to the flow of
electrons. Because electrons carry a negative charge, they move in the
direction opposite to conventional current.
On the other hand, inside a bipolar transistor, currents can be
composed of both positively charged holes and negatively charged
electrons. In this article, current arrows are shown in the
conventional direction, but labels for the movement of holes and
electrons show their actual direction inside the transistor. The arrow
on the symbol for bipolar transistors indicates the PN junction between
base and emitter and points in the direction in which conventional
current travels.
Function
BJTs are available in two types, or polarities, known as PNP and NPN based on the doping types of the three main terminal regions. An NPN transistor comprises two semiconductor junctions that share a thin p-doped region, and a PNP transistor comprises two semiconductor junctions that share a thin n-doped region.
Charge flow in a BJT is due to diffusion of charge carriers across a junction between two regions of different charge concentrations. The regions of a BJT are called emitter, base, and collector.
A discrete transistor has three leads for connection to these regions.
Typically, the emitter region is heavily doped compared to the other two
layers, and the collector is doped much lighter than the base
(collector doping is typically ten times lighter than base doping).
By design, most of the BJT collector current is due to the flow of
charge carriers (electrons or holes) injected from a heavily doped
emitter into the base where they are minority carriers that diffuse toward the collector, and so BJTs are classified as minority-carrier devices.
In typical operation of an NPN device, the base–emitter junction is forward-biased,
which means that the p-doped side of the junction is at a more positive
potential than the n-doped side, and the base–collector junction is reverse-biased. When forward bias is applied to the base–emitter junction, the equilibrium between the thermally generated carriers and the repelling electric field of the n-doped emitter depletion region is disturbed. This allows thermally excited electrons to inject from the emitter into the base region. These electrons diffuse
through the base from the region of high concentration near the emitter
toward the region of low concentration near the collector. The
electrons in the base are called minority carriers because the base is doped p-type, which makes holes the majority carrier in the base. In a PNP device, analogous behaviour occurs, but with holes as the dominant current carriers.
To minimize the fraction of carriers that recombine
before reaching the collector–base junction, the transistor's base
region must be thin enough that carriers can diffuse across it in much
less time than the semiconductor's minority-carrier lifetime. Having a
lightly doped base ensures recombination rates are low. In particular,
the thickness of the base must be much less than the diffusion length
of the electrons. The collector–base junction is reverse-biased, and so
negligible electron injection occurs from the collector to the base,
but carriers that are injected into the base and diffuse to reach the
collector-base depletion region are swept into the collector by the
electric field in the depletion region. The thin shared base and asymmetric collector–emitter doping are what differentiates a bipolar transistor from two separate and oppositely biased diodes connected in series.
Voltage, current, and charge control
The
collector–emitter current can be viewed as being controlled by the
base–emitter current (current control), or by the base–emitter voltage
(voltage control). These views are related by the current–voltage
relation of the base–emitter junction, which is the usual exponential
current–voltage curve of a p–n junction (diode).
The explanation for collector current is the concentration gradient of minority carriers in the base region. Due to low-level injection (in which there are much fewer excess carriers than normal majority carriers) the ambipolar transport
rates (in which the excess majority and minority carriers flow at the
same rate) is in effect determined by the excess minority carriers.
Detailed transistor models of transistor action, such as the Gummel–Poon model, account for the distribution of this charge explicitly to explain transistor behaviour more exactly. The charge-control view easily handles phototransistors, where minority carriers in the base region are created by the absorption of photons,
and handles the dynamics of turn-off, or recovery time, which depends
on charge in the base region recombining. However, because base charge
is not a signal that is visible at the terminals, the current- and
voltage-control views are generally used in circuit design and analysis.
In analog circuit
design, the current-control view is sometimes used because it is
approximately linear. That is, the collector current is approximately
times the base current. Some basic circuits can be designed by assuming
that the base-emitter voltage is approximately constant and that
collector current is β times the base current. However, to accurately
and reliably design production BJT circuits, the voltage-control (for
example, Ebers–Moll) model is required.
The voltage-control model requires an exponential function to be taken
into account, but when it is linearized such that the transistor can be
modeled as a transconductance, as in the Ebers–Moll model,
design for circuits such as differential amplifiers again becomes a
mostly linear problem, so the voltage-control view is often preferred.
For translinear circuits,
in which the exponential I–V curve is key to the operation, the
transistors are usually modeled as voltage-controlled current sources
whose transconductance is proportional to their collector current. In general, transistor-level circuit analysis is performed using SPICE
or a comparable analog-circuit simulator, so mathematical model
complexity is usually not of much concern to the designer, but a
simplified view of the characteristics allows designs to be created
following a logical process.
Turn-on, turn-off, and storage delay
Bipolar transistors, and particularly power transistors, have long
base-storage times when they are driven into saturation; the base
storage limits turn-off time in switching applications. A Baker clamp
can prevent the transistor from heavily saturating, which reduces the
amount of charge stored in the base and thus improves switching time.
Transistor characteristics: alpha (α) and beta (β)
The
proportion of carriers able to cross the base and reach the collector
is a measure of the BJT efficiency. The heavy doping of the emitter
region and light doping of the base region causes many more electrons to
be injected from the emitter into the base than holes to be injected
from the base into the emitter. A thin and lightly-doped base region
means that most of the minority carriers that are injected into the base
will diffuse to the collector and not recombine.
The common-emitter current gain is represented by βF or the h-parameter hFE;
it is approximately the ratio of the DC collector current to the DC
base current in forward-active region. It is typically greater than 50
for small-signal transistors, but can be smaller in transistors designed
for high-power applications. Both injection efficiency and
recombination in the base reduce the BJT gain.
Another useful characteristic is the common-base current gain, αF.
The common-base current gain is approximately the gain of current from
emitter to collector in the forward-active region. This ratio usually
has a value close to unity; between 0.980 and 0.998. It is less than
unity due to recombination of charge carriers as they cross the base region.
Alpha and beta are related by the following identities:
Beta is a convenient figure of merit to describe the performance of a
bipolar transistor, but is not a fundamental physical property of the
device. Bipolar transistors can be considered voltage-controlled devices
(fundamentally the collector current is controlled by the base-emitter
voltage; the base current could be considered a defect and is controlled
by the characteristics of the base-emitter junction and recombination
in the base). In many designs beta is assumed high enough so that base
current has a negligible effect on the circuit. In some circuits
(generally switching circuits), sufficient base current is supplied so
that even the lowest beta value a particular device may have will still
allow the required collector current to flow.
Structure
A BJT consists of three differently doped semiconductor regions: the emitter region, the base region and the collector region. These regions are, respectively, p type, n type and p type in a PNP transistor, and n type, p type and n type in an NPN transistor. Each semiconductor region is connected to a terminal, appropriately labeled: emitter (E), base (B) and collector (C).
The base is physically located between the emitter and the collector
and is made from lightly doped, high-resistivity material. The
collector surrounds the emitter region, making it almost impossible for
the electrons injected into the base region to escape without being
collected, thus making the resulting value of α very close to unity, and
so, giving the transistor a large β. A cross-section view of a BJT
indicates that the collector–base junction has a much larger area than
the emitter–base junction.
The bipolar junction transistor, unlike other transistors, is
usually not a symmetrical device. This means that interchanging the
collector and the emitter makes the transistor leave the forward active
mode and start to operate in reverse mode. Because the transistor's
internal structure is usually optimized for forward-mode operation,
interchanging the collector and the emitter makes the values of α and β
in reverse operation much smaller than those in forward operation; often
the α of the reverse mode is lower than 0.5. The lack of symmetry is
primarily due to the doping ratios of the emitter and the collector. The
emitter is heavily doped, while the collector is lightly doped,
allowing a large reverse bias voltage to be applied before the
collector–base junction breaks down. The collector–base junction is
reverse biased in normal operation. The reason the emitter is heavily
doped is to increase the emitter injection efficiency: the ratio of
carriers injected by the emitter to those injected by the base. For high
current gain, most of the carriers injected into the emitter–base
junction must come from the emitter.
The low-performance "lateral" bipolar transistors sometimes used in CMOS processes are sometimes designed symmetrically, that is, with no difference between forward and backward operation.
Small changes in the voltage applied across the base–emitter terminals cause the current between the emitter and the collector
to change significantly. This effect can be used to amplify the input
voltage or current. BJTs can be thought of as voltage-controlled current sources,
but are more simply characterized as current-controlled current
sources, or current amplifiers, due to the low impedance at the base.
Early transistors were made from germanium but most modern BJTs are made from silicon. A significant minority are also now made from gallium arsenide, especially for very high speed applications (see HBT, below).
NPN
NPN is one of the two types of bipolar transistors, consisting of a layer of P-doped
semiconductor (the "base") between two N-doped layers. A small current
entering the base is amplified to produce a large collector and emitter
current. That is, when there is a positive potential difference measured
from the base of an NPN transistor to its emitter (that is, when the
base is high relative to the emitter), as well as a positive
potential difference measured from the collector to the emitter, the
transistor becomes active. In this "on" state, current flows from the
collector to the emitter of the transistor. Most of the current is
carried by electrons moving from emitter to collector as minority carriers
in the P-type base region. To allow for greater current and faster
operation, most bipolar transistors used today are NPN because electron mobility is higher than hole mobility.
PNP
The other type of BJT is the PNP, consisting of a layer of N-doped
semiconductor between two layers of P-doped material. A small current
leaving the base is amplified in the collector output. That is, a PNP
transistor is "on" when its base is pulled low relative to the
emitter.
In a PNP transistor, the emitter–base region is forward biased, so holes
are injected into the base as minority carriers. The base is very thin,
and most of the holes cross the reverse-biased base–collector junction
to the collector.
The arrows in the NPN and PNP transistor symbols indicate the PN
junction between the base and emitter. When the device is in forward
active or forward saturated mode, the arrow, placed on the emitter leg,
points in the direction of the conventional current.
Heterojunction bipolar transistor
The heterojunction bipolar transistor (HBT) is an improvement of the BJT that can handle signals of very high frequencies up to several hundred GHz. It is common in modern ultrafast circuits, mostly RF systems.
Heterojunction transistors have different semiconductors for the
elements of the transistor. Usually the emitter is composed of a larger
bandgap material than the base. The figure shows that this difference in
bandgap allows the barrier for holes to inject backward from the base
into the emitter, denoted in the figure as Δφp, to be made large, while the barrier for electrons to inject into the base Δφn
is made low. This barrier arrangement helps reduce minority carrier
injection from the base when the emitter-base junction is under forward
bias, and thus reduces base current and increases emitter injection
efficiency.
The improved injection of carriers into the base allows the base
to have a higher doping level, resulting in lower resistance to access
the base electrode. In the more traditional BJT, also referred to as
homojunction BJT, the efficiency of carrier injection from the emitter
to the base is primarily determined by the doping ratio between the
emitter and base, which means the base must be lightly doped to obtain
high injection efficiency, making its resistance relatively high. In
addition, higher doping in the base can improve figures of merit like
the Early voltage by lessening base narrowing.
The grading of composition in the base, for example, by progressively increasing the amount of germanium in a SiGe transistor, causes a gradient in bandgap in the neutral base, denoted in the figure by ΔφG, providing a "built-in" field that assists electron transport across the base. That drift component
of transport aids the normal diffusive transport, increasing the
frequency response of the transistor by shortening the transit time
across the base.
Two commonly used HBTs are silicon–germanium and aluminum gallium
arsenide, though a wide variety of semiconductors may be used for the
HBT structure. HBT structures are usually grown by epitaxy techniques like MOCVD and MBE.
Regions of operation
Junction type |
Applied voltages |
Junction bias | Mode | |
---|---|---|---|---|
B-E | B-C | |||
NPN | E < B < C | Forward | Reverse | Forward-active |
E < B > C | Forward | Forward | Saturation | |
E > B < C | Reverse | Reverse | Cut-off | |
E > B > C | Reverse | Forward | Reverse-active | |
PNP | E < B < C | Reverse | Forward | Reverse-active |
E < B > C | Reverse | Reverse | Cut-off | |
E > B < C | Forward | Forward | Saturation | |
E > B > C | Forward | Reverse | Forward-active |
Bipolar transistors have four distinct regions of operation, defined by BJT junction biases.
- Forward-active (or simply active)
- The base–emitter junction is forward biased and the base–collector junction is reverse biased. Most bipolar transistors are designed to afford the greatest common-emitter current gain, βF, in forward-active mode. If this is the case, the collector–emitter current is approximately proportional to the base current, but many times larger, for small base current variations.
- Reverse-active (or inverse-active or inverted)
- By reversing the biasing conditions of the forward-active region, a bipolar transistor goes into reverse-active mode. In this mode, the emitter and collector regions switch roles. Because most BJTs are designed to maximize current gain in forward-active mode, the βF in inverted mode is several times smaller (2–3 times for the ordinary germanium transistor). This transistor mode is seldom used, usually being considered only for failsafe conditions and some types of bipolar logic. The reverse bias breakdown voltage to the base may be an order of magnitude lower in this region.
- Saturation
- With both junctions forward-biased, a BJT is in saturation mode and facilitates high current conduction from the emitter to the collector (or the other direction in the case of NPN, with negatively charged carriers flowing from emitter to collector). This mode corresponds to a logical "on", or a closed switch.
- Cut-off
- In cut-off, biasing conditions opposite of saturation (both junctions reverse biased) are present. There is very little current, which corresponds to a logical "off", or an open switch.
- Avalanche breakdown region
The modes of operation can be described in terms of the applied
voltages (this description applies to NPN transistors; polarities are
reversed for PNP transistors):
- Forward-active
- Base higher than emitter, collector higher than base (in this mode the collector current is proportional to base current by ).
- Saturation
- Base higher than emitter, but collector is not higher than base.
- Cut-off
- Base lower than emitter, but collector is higher than base. It means the transistor is not letting conventional current go through from collector to emitter.
- Reverse-active
- Base lower than emitter, collector lower than base: reverse conventional current goes through transistor.
In terms of junction biasing: (reverse biased base–collector junction means Vbc < 0 for NPN, opposite for PNP).
Although these regions are well defined for sufficiently large
applied voltage, they overlap somewhat for small (less than a few
hundred millivolts) biases. For example, in the typical grounded-emitter
configuration of an NPN BJT used as a pulldown switch in digital logic,
the "off" state never involves a reverse-biased junction because the
base voltage never goes below ground; nevertheless the forward bias is
close enough to zero that essentially no current flows, so this end of
the forward active region can be regarded as the cutoff region.
Active-mode transistors in circuits
The diagram shows a schematic representation of an NPN transistor
connected to two voltage sources. (The same description applies to a PNP
transistor with reversed directions of current flow and applied
voltage.) This applied voltage causes the lower P-N junction to become
forward biased, allowing a flow of electrons from the emitter into the
base. In active mode, the electric field existing between base and
collector (caused by VCE) will cause the majority of these electrons to cross the upper P-N junction into the collector to form the collector current IC.
The remainder of the electrons recombine with holes, the majority
carriers in the base, making a current through the base connection to
form the base current, IB. As shown in the diagram, the emitter current, IE, is the total transistor current, which is the sum of the other terminal currents, (i.e., IE = IB + IC).
In the diagram, the arrows representing current point in the direction of conventional current – the flow of electrons is in the opposite direction of the arrows because electrons carry negative electric charge. In active mode, the ratio of the collector current to the base current is called the DC current gain. This gain is usually 100 or more, but robust circuit designs do not depend on the exact value (for example see op-amp). The value of this gain for DC signals is referred to as , and the value of this gain for small signals is referred to as .
That is, when a small change in the currents occurs, and sufficient
time has passed for the new condition to reach a steady state is the ratio of the change in collector current to the change in base current. The symbol is used for both and .
The emitter current is related to exponentially. At room temperature, an increase in
by approximately 60 mV increases the emitter current by a factor of 10.
Because the base current is approximately proportional to the collector
and emitter currents, they vary in the same way.
History
The bipolar point-contact transistor was invented in December 1947 at the Bell Telephone Laboratories by John Bardeen and Walter Brattain under the direction of William Shockley. The junction version known as the bipolar junction transistor (BJT), invented by Shockley in 1948, was for three decades the device of choice in the design of discrete and integrated circuits. Nowadays, the use of the BJT has declined in favor of CMOS
technology in the design of digital integrated circuits. The incidental
low performance BJTs inherent in CMOS ICs, however, are often utilized
as bandgap voltage reference, silicon bandgap temperature sensor and to handle electrostatic discharge.
Germanium transistors
The germanium transistor was more common in the 1950s and 1960s but has a greater tendency to exhibit thermal runaway.
Early manufacturing techniques
Various methods of manufacturing bipolar transistors were developed.
Bipolar transistors
- Point-contact transistor – first transistor ever constructed (December 1947), a bipolar transistor, limited commercial use due to high cost and noise.
- Tetrode point-contact transistor – Point-contact transistor having two emitters. It became obsolete in the middle 1950s.
- Junction transistors
- Grown-junction transistor – first bipolar junction transistor made. Invented by William Shockley at Bell Labs on June 23, 1948. Patent filed on June 26, 1948.
- Alloy-junction transistor – emitter and collector alloy beads fused to base. Developed at General Electric and RCA in 1951.
- Micro-alloy transistor (MAT) – high-speed type of alloy junction transistor. Developed at Philco.
- Micro-alloy diffused transistor (MADT) – high-speed type of alloy junction transistor, speedier than MAT, a diffused-base transistor. Developed at Philco.
- Post-alloy diffused transistor (PADT) – high-speed type of alloy junction transistor, speedier than MAT, a diffused-base transistor. Developed at Philips.
- Tetrode transistor – high-speed variant of grown-junction transistor or alloy junction transistor with two connections to base.
- Surface-barrier transistor – high-speed metal-barrier junction transistor. Developed at Philco in 1953.
- Drift-field transistor – high-speed bipolar junction transistor. Invented by Herbert Kroemer at the Central Bureau of Telecommunications Technology of the German Postal Service, in 1953.
- Spacistor – around 1957.
- Diffusion transistor – modern type bipolar junction transistor. Prototypes developed at Bell Labs in 1954.
- Diffused-base transistor – first implementation of diffusion transistor.
- Mesa transistor – developed at Texas Instruments in 1957.
- Planar transistor – the bipolar junction transistor that made mass-produced monolithic integrated circuits possible. Developed by Jean Hoerni at Fairchild in 1959.
- Epitaxial transistor – a bipolar junction transistor made using vapor-phase deposition. See epitaxy. Allows very precise control of doping levels and gradients.
Theory and modeling
Transistors can be thought of as two diodes (P–N junctions)
sharing a common region that minority carriers can move through. A PNP
BJT will function like two diodes that share an N-type cathode region,
and the NPN like two diodes sharing a P-type anode region. Connecting
two diodes with wires will not make a transistor, since minority
carriers will not be able to get from one P–N junction to the other
through the wire.
Both types of BJT function by letting a small current input to
the base control an amplified output from the collector. The result is
that the transistor makes a good switch that is controlled by its base
input. The BJT also makes a good amplifier, since it can multiply a weak
input signal to about 100 times its original strength. Networks of
transistors are used to make powerful amplifiers with many different
applications. In the discussion below, focus is on the NPN bipolar
transistor. In the NPN transistor in what is called active mode, the
base–emitter voltage and collector–base voltage
are positive, forward biasing the emitter–base junction and
reverse-biasing the collector–base junction. In the active mode of
operation, electrons are injected from the forward biased n-type emitter
region into the p-type base where they diffuse as minority carriers to
the reverse-biased n-type collector and are swept away by the electric
field in the reverse-biased collector–base junction. For a figure
describing forward and reverse bias, see semiconductor diodes.
Large-signal models
In 1954, Jewell James Ebers and John L. Moll introduced their mathematical model of transistor currents.
Ebers–Moll model
The DC emitter and collector currents in active mode are well modeled by an approximation to the Ebers–Moll model.
The base internal current is mainly by diffusion (see Fick's law) and
where
- is the thermal voltage (approximately 26 mV at 300 K ≈ room temperature).
- is the emitter current
- is the collector current
- is the common base forward short-circuit current gain (0.98 to 0.998)
- is the reverse saturation current of the base–emitter diode (on the order of 10−15 to 10−12 amperes)
- is the base–emitter voltage
- is the diffusion constant for electrons in the p-type base
- W is the base width
The and forward parameters are as described previously. A reverse is sometimes included in the model.
The unapproximated Ebers–Moll equations used to describe the
three currents in any operating region are given below. These equations
are based on the transport model for a bipolar junction transistor.
where
- is the collector current
- is the base current
- is the emitter current
- is the forward common emitter current gain (20 to 500)
- is the reverse common emitter current gain (0 to 20)
- is the reverse saturation current (on the order of 10−15 to 10−12 amperes)
- is the thermal voltage (approximately 26 mV at 300 K ≈ room temperature).
- is the base–emitter voltage
- is the base–collector voltage
Base-width modulation
As the collector–base voltage ()
varies, the collector–base depletion region varies in size. An increase
in the collector–base voltage, for example, causes a greater reverse
bias across the collector–base junction, increasing the collector–base
depletion region width, and decreasing the width of the base. This
variation in base width often is called the Early effect after its discoverer James M. Early.
Narrowing of the base width has two consequences:
- There is a lesser chance for recombination within the "smaller" base region.
- The charge gradient is increased across the base, and consequently, the current of minority carriers injected across the emitter junction increases.
Both factors increase the collector or "output" current of the
transistor in response to an increase in the collector–base voltage.
In the forward-active region, the Early effect modifies the collector current () and the forward common emitter current gain () as given by:
where:
- is the collector–emitter voltage
- is the Early voltage (15 V to 150 V)
- is forward common-emitter current gain when = 0 V
- is the output impedance
- is the collector current
Punchthrough
When
the base–collector voltage reaches a certain (device-specific) value,
the base–collector depletion region boundary meets the base–emitter
depletion region boundary. When in this state the transistor effectively
has no base. The device thus loses all gain when in this state.
Gummel–Poon charge-control model
The Gummel–Poon model
is a detailed charge-controlled model of BJT dynamics, which has been
adopted and elaborated by others to explain transistor dynamics in
greater detail than the terminal-based models typically do. This model also includes the dependence of transistor -values upon the direct current levels in the transistor, which are assumed current-independent in the Ebers–Moll model.
Small-signal models
Hybrid-pi model
The hybrid-pi model is a popular circuit model used for analyzing the small signal and AC behavior of bipolar junction and field effect transistors. Sometimes it is also called Giacoletto model because it was introduced by L.J. Giacoletto
in 1969. The model can be quite accurate for low-frequency circuits and
can easily be adapted for higher-frequency circuits with the addition
of appropriate inter-electrode capacitances and other parasitic elements.
h-parameter model
Another model commonly used to analyze BJT circuits is the h-parameter model, closely related to the hybrid-pi model and the y-parameter two-port,
but using input current and output voltage as independent variables,
rather than input and output voltages. This two-port network is
particularly suited to BJTs as it lends itself easily to the analysis of
circuit behaviour, and may be used to develop further accurate models.
As shown, the term, x, in the model represents a different BJT
lead depending on the topology used. For common-emitter mode the various
symbols take on the specific values as:
- Terminal 1, base
- Terminal 2, collector
- Terminal 3 (common), emitter; giving x to be e
- ii, base current (ib)
- io, collector current (ic)
- Vin, base-to-emitter voltage (VBE)
- Vo, collector-to-emitter voltage (VCE)
and the h-parameters are given by:
- hix = hie, the input impedance of the transistor (corresponding to the base resistance rpi).
- hrx = hre, represents the dependence of the transistor's IB–VBE curve on the value of VCE. It is usually very small and is often neglected (assumed to be zero).
- hfx = hfe, the current-gain of the transistor. This parameter is often specified as hFE or the DC current-gain (βDC) in datasheets.
- hox = 1/hoe, the output impedance of transistor. The parameter hoe usually corresponds to the output admittance of the bipolar transistor and has to be inverted to convert it to an impedance.
As shown, the h-parameters have lower-case subscripts and hence
signify AC conditions or analyses. For DC conditions they are specified
in upper-case. For the CE topology, an approximate h-parameter model is
commonly used which further simplifies the circuit analysis. For this
the hoe and hre parameters are
neglected (that is, they are set to infinity and zero, respectively).
The h-parameter model as shown is suited to low-frequency, small-signal
analysis. For high-frequency analyses the inter-electrode capacitances
that are important at high frequencies must be added.
Etymology of hFE
The h refers to its being an h-parameter, a set of parameters named for their origin in a hybrid equivalent circuit model. F is from forward current amplification also called the current gain. E refers to the transistor operating in a common emitter (CE) configuration. Capital letters used in the subscript indicate that hFE refers to a direct current circuit.
Industry models
The Gummel–Poon SPICE model is often used, but it suffers from
several limitations. These have been addressed in various more advanced
models: Mextram, VBIC, HICUM, Modella.
Applications
The
BJT remains a device that excels in some applications, such as discrete
circuit design, due to the very wide selection of BJT types available,
and because of its high transconductance and output resistance compared to MOSFETs.
The BJT is also the choice for demanding analog circuits, especially for very-high-frequency applications, such as radio-frequency circuits for wireless systems.
High-speed digital logic
Emitter-coupled logic (ECL) use BJTs.
Bipolar transistors can be combined with MOSFETs in an integrated circuit by using a BiCMOS process of wafer fabrication to create circuits that take advantage of the application strengths of both types of transistor.
Amplifiers
The transistor parameters α and β characterizes the current gain
of the BJT. It is this gain that allows BJTs to be used as the building
blocks of electronic amplifiers. The three main BJT amplifier
topologies are:
Temperature sensors
Because of the known temperature and current dependence of the
forward-biased base–emitter junction voltage, the BJT can be used to
measure temperature by subtracting two voltages at two different bias
currents in a known ratio.
Logarithmic converters
Because
base–emitter voltage varies as the logarithm of the base–emitter and
collector–emitter currents, a BJT can also be used to compute logarithms and anti-logarithms. A diode can also perform these nonlinear functions but the transistor provides more circuit flexibility.
Vulnerabilities
Exposure of the transistor to ionizing radiation causes radiation damage. Radiation causes a buildup of 'defects' in the base region that act as recombination centers. The resulting reduction in minority carrier lifetime causes gradual loss of gain of the transistor.
Transistors have "maximum ratings", including power ratings (essentially limited by self-heating), maximum collector and base currents (both continuous/DC ratings and peak), and breakdown voltage ratings, beyond which the device may fail or at least perform badly.
In addition to normal breakdown ratings of the device, power BJTs are subject to a failure mode called secondary breakdown,
in which excessive current and normal imperfections in the silicon die
cause portions of the silicon inside the device to become
disproportionately hotter than the others. The electrical resistivity of
doped silicon, like other semiconductors, has a negative temperature coefficient,
meaning that it conducts more current at higher temperatures. Thus, the
hottest part of the die conducts the most current, causing its
conductivity to increase, which then causes it to become progressively
hotter again, until the device fails internally. The thermal runaway
process associated with secondary breakdown, once triggered, occurs
almost instantly and may catastrophically damage the transistor package.